Newsgroups: sci.physics.plasma
From: pacbell!pronto!dlf@PacBell.COM
Subject: 3rd Intl Symp on Advanced Plasma Tools & Sources
Approved: eastman@glue.umd.edu

* * * CALL FOR PAPERS * * *

Third International Workshop on
Advanced Plasma Tools for Etching, CVD and PVD:
Sources, Process Control & Diagnostics

May 3-4, 1995
LeBaron Hotel, San Jose, CA

* WORKSHOP ON PLASMA SOURCES
-Advanced high-density sources
-Large area plasma tools
-Tool/source interactions
-Model-based source design and development
-Materials, compatibility
-RF & microwave power systems design

* REAL TIME PROCESS CONTROL STRATEGIES
-Advanced feedback control
-Neural networks, fuzzy logic, "smart" systems
-Model-based system control

* WORKSHOP ON PLASMA TOOL SUBSYSTEMS
-Sensors, sensor systems and sensor data interpretation
-Optical, probe, mass spec. & electrical diagnostics
-Cluster integration
-Gas distribution, flow and pressure control

* WAFER AND CHAMBER CLEANING STRATEGIES
-Monitoring techniques
-Cleaning processes and conditions
-Mechanical and materials

* DAMAGE MONITORING AND CONTROL
-Measurement techniques
-Influence of plasma source
-Process effects
-Damage reduction

* MODELING
-1d, 2d and 3d particle codes
-Analytic models
-Hybrid and heuristic simulations

Final Abstract Deadline: March 3, 1995

Please submit: Title, 1-page abstract (optional: 1 page of figures) by fax,
email or surface mail to:

3rd International Workshop on Advanced Plasma Tools, c/o:
Calvin Gabriel, VLSI Technology, 1109 McKay Drive MS02, San Jose, CA 95131
Fax:(408) 321-9078, Email: calvin@raven.sanjose.vlsi.com
or
Daniel Flamm, Dept. EECS, U.C. Berkeley, Berkeley, CA 94720-1770
Fax: (510) 643-8426, Email: dlf@eecs.berkeley.edu

Proceedings papers will be published as a special volume.
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Plasma Etch Users Group / Northern California Chapter American Vacuum Society
with assistance of SEMI (Semiconductor Equipment and Materials, International)